Metal-ceramic brazed assemblies.

Highly vacuum-tight components for the highest demands

The technology used involves metallization of the ceramic base body at the joints using Mo/Mn paste. This is applied mechanically and baked at high temperature. As a result, diffusion creates a material bond between the ceramic and the metallization. This metallization can be soldered to metallic components. As a rule, we use a brazing alloy for this purpose. Another joining technology available is active soldering, in which the soldering and metallization processes take place in a single process step.

This process creates joints with high bond strength. These also meet the requirements for high-vacuum-tight (high-pressure-tight) components and are used, for example, in power electronics.

More than 50 years of experience

QSIL has more than 50 years of experience in the production of ceramic-to-metal solder joints. Our process experience, coupled with state-of-the-art equipment, allows us to realize sophisticated customer-specific assemblies. The spectrum of services ranges from constructive design and prototype production to series delivery. This process, including the preparation of the ceramic raw materials, is carried out at the Auma-Weidatal site.

Ceramic-to-metal solder joints are used as high-performance insulators in various types of feedthroughs (electrical, thermal or fluidic). The high bond strength of the joint – combined with high vacuum tightness, temperature resistance and electrical insulation capability – predestine these components for a wide range of applications. Below you will find some of them listed as examples.

Possible applications:

• Insulators for high power tubes (X-ray tubes, transmitter tubes)
• Isolators for analytical instrumentation / physical research (cyclotrons, accelerator sections, mass spectrometers)
• Laser applications
• Sensor applications
• Housings for electronic components and switches