Wafers / Base plates (MEMS).

High strength and damage tolerance

Thin sheets of silicon nitride are particularly suitable for the support surfaces of wafer carriers and suction plates used for polishing, masking, etching, patterning and coating wafers. Due to the high strength and damage tolerance, it is also possible to manufacture particularly thin components and to provide them individually with laser drilled holes or surface structures. This results in “wafer probecards”, which enable the final inspection of microchips and fully assembled boards.

Special advantages of silicon nitride as a material:

• High chemical purity, species-like composition
• High abrasion resistance / protection against cross-contamination
• Good temperability or thermal conductivity
• High electrical resistance (¹⁰¹⁴ Ωcm)
• Can be individually laser drilled and structured